The TX embedded module integrates all the core components of a common PC and is mounted onto an application specific carrier board. TX modules have a standardized form factor of 67,6mm x 26mm, have specified pinouts and provide the functional requirements for an embedded application. These functions include, but are not limited to, graphics, network and multiple USB ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the I/O signals to and from the TX module. This SO-DIMM connector is a well known and proven high speed signal interface connector that is commonly used for memory cards in notebooks.

The TX embedded module integrates all the core components of a common PC and is mounted onto an application specific carrier board. TX modules have a standardized form factor of 67,6mm x 26mm, have specified pinouts and provide the functional requirements for an embedded application. These functions include, but are not limited to, graphics, network and multiple USB ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the I/O signals to and from the TX module. This SO-DIMM connector is a well known and proven high speed signal interface connector that is commonly used for memory cards in notebooks.

The TX embedded module integrates all the core components of a common PC and is mounted onto an application specific carrier board. TX modules have a standardized form factor of 67,6mm x 26mm, have specified pinouts and provide the functional requirements for an embedded application. These functions include, but are not limited to, graphics, network and multiple USB ports. A single ruggedized SO-DIMM connector provides the carrier board interface to carry all the I/O signals to and from the TX module. This SO-DIMM connector is a well known and proven high speed signal interface connector that is commonly used for memory cards in notebooks.

The new QSXP Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29mm and a height of 2.6mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 108 pads. The ground pad additionally acts as thermal pad.

The TX6UL Evaluation Kit combines the powerful and low-power ARM Cortex A7-based i.MX 6UltraLite COM with a simple baseboard that provides the most common interfaces for industrial products, including Dual Ethernet, Wi-Fi, Dual CAN, 8 UARTS, USB and an option LCD. The kit is well-suited for applications in industrial automation, gateways and hubs, medical technology, energy and transportation.

Our new QSXM Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29mm and a height of 2.6mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 108 pads. The ground pad additionally acts as thermal pad.

Often, devices are required in different performance and price classes. This is where Ka-Ro’s TX standard comes into its own. With one single hardware design embedded engineers can produce a range of pin- and software-compatible products. Ka-Ro introduced the TX CoM standard over six years ago. Until today, the Ka-Ro Starter Kit V has served as the unchanged development environment for all Ka-Ro TX modules underlining Ka-Ro’s long-term product and family strategy. All the TX modules can be used on the Starter Kit V which enables great scalability and flexibility.