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Tools & Components

Tools and components for embedded development that make your life as a developer more efficient, fun and stress-free. Logic Technology offers only high-quality embedded software- and hardware tools and components.

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Bootloaders, UEFI BIOS and OpenBMC Boundary Scan Testing Code Coverage Coding Standards Communication Protocols and Stacks Computer Modules Connectors Data Management Debuggers and Trace Dependency Structure Matrix – DSM Development Kits Device Programmers File Systems IDEs IoT and Edge device security Model Driven Software Engineering RTOS Real-Time Operating systems Software Quality Tools Static Code Analysis Storyboard 9.0: Unconstrained Design, Unlimited Development for Embedded GUIs TBsafe Test and Burn-In Sockets Traceability and Certification UI Graphical Interface Software Unit Testing

QS8M Solder-Down SoM

The QS8M is a QFN Style Solder-Down Computer On Module. The module with a small square size of 27mm and a height of 2.3mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as thermal pad.

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QS93-NXP

€ 54,-

(starting from excl. VAT)

The i.MX 8M Mini applications processor blends advanced processing capabilities with sophisticated audio, video, and graphics to deliver low-power and high-performing solutions for embedded consumer and industrial applications.

NXP_i.MX8M_mini_Block_Diagram

Variants

Part NumberQS8M-MQ00QS8M-ND00
Part NameQS8M/MQ/1600/1024S/4GF/E85QS8M/ND/1400/512S/4GF/E85
ProcessorNXP i.MX8M Mini Quad 1.6 GHzNXP i.MX8M Nano Dual 1.4 GHz
SDRAM1 GiB512 MiB
Flash4 GB4GB
Display-IFMIPIMIPI
Temperature-25 °C to 85 °C-25 °C to 85 °C

Socketed Version

A Socketed version of the QS91 is available upon request.

Part Number: QS8M-MQ00/SOCK QS8M-ND00/SOCK

Specifications:

  • 33mm square
  • 2mm stacking height
  • Two 80 pin connectors
  • Easy to lock with screws
  • Optional shielding cabinet
  • 5.7 mm total height

Pre-programmed

All modules will be shipped with a pre-programmed bootloader by default. To speed up the production process, the modules can also be pre-programmed to customer specifications. JEDEC version 5.0 introduces “Production State Awareness” to help avoid possible data corruption during soldering. Only a predefined part of the whole device’s available space can be supported by this feature.

BSP Support and Services

Our Application Support Team can help you customize the included Linux Board Support Package, ensuring optimal performance, faster time-to-market, and seamless integration with your development environment, hardware and applications.

Gilles Hendrikx

Gilles Hendrikx

Build Acceleration | Boards | UI | Development

Questions?

The i.MX 93 applications processors are the first in the i.MX portfolio to integrate the scalable Arm® Cortex®-A55 core, bringing best-in-class performance and energy efficiency to Linux-based edge applications.

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