Test and Burn-In Sockets
In industry, in medical technology, in high-speed networks, smartphones, in space travel or in the automotive sector. Wherever you need a solid, reliable interconnect or semiconductor contacting solution, we can support you with off-the-shelve or custom made sockets.Ask us for a quote
Our portfolio includes an ultra wide variety starting with pioneering pin through hole devices from SIP and (S)DIP to ZIP and PGA’s. In our socket portfolio we offer solutions (either THT or CMT) for surface-mounted devices such as SOJ, PLCC, (x)QFP, (x)SO's, LCC’s, QFN’s and LGA’s with pitches from 0.3mm to 2.54mm
For special device form factors or electrical and thermal requirements, we offer either our unique modular Y-RED test contactor system or a full tailor-made contacting system.
Serving a wide package variety our semi-custom clamshell IC561 / IC564 and open top NP584 CMT socket solution. Suitable for BGA, CSP, QFN, SON, LGA packages and the right choice for your challenging validation and burn-in tasks.
- Huge variety of standard and customized test socket solutions
- Availability of lots of different package sizes or shapes with different pin counts
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