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QSMP-15 Solder-Down SoM

The QSMP is a QFN Style Solder-Down Computer On Module. The module with a small square size of 27mm and a height of 2.3mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 100 pads. The ground pad additionally acts as thermal pad.

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ka-ro electronics

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€ 42,-

(starting from excl. VAT)

STM32MP1 microprocessor series from single Arm® Cortex®-A7 up to dual Arm® Cortex®-A7 and Cortex®-M4 cores.

A general-purpose microprocessor portfolio enabling easy development for a broad range of applications, the STM32MP1 series has the ability to support multiple and flexible applications, achieving optimal performance and power efficiency at all times.

The STM32MP1 microprocessor portfolio comes in two main configurations:

  • STM32MP13x product line helps optimize the energy consumption and reduce costs while offering certified security for entry level Linux, bare metal or RTOS-based systems.
  • STM32MP15x product line offers heterogeneous processing to support Linux and real-time applications.

The STM32MP1 series has been designed to meet the increasing demand for security in Industry 4.0, smart city and smart home applications. Beyond security, the series helps efficiently reduce energy consumption and cost. To meet industrial requirements, this series offer an extended junction temperature up to 125°.

STM32MP15

Variants

Part NumberQSMP-1570QSMP-1570WQSMP-1530C
Part NameQSMP/157C/512S/4GF/E85QSMP/157C/512S/4GF/WLAN/IQSMP/157C/256S/4GF/E85
ProcessorSTM32MP157CSTM32MP157CSTM32MP157C
SDRAM512 MiB512 MiB256 MiB
Flash4 GB eMMC4 GB eMMC4 GB eMMC
Display-IF24-bit RGB + 2-lane MIPI-DSI24-bit RGB + 2-lane MIPI-DSI24-bit RGB + 2-lane MIPI-DSI
Wireless-WiFi+Bluetooth-
Temperature-25 °C to 85 °C-40 °C to 85 °C-25 °C to 85 °C

Socketed Version

A Socketed version of thee QSMP-135 is available upon request.

Specifications:

  • 33mm square
  • 2mm stacking height
  • Two 80 pin connectors
  • Easy to lock with screws
  • Optional shielding cabinet
  • 5.3 mm total height

Pre-programmed

All modules will be shipped with a pre-programmed bootloader by default. To speed up the production process, the modules can also be pre-programmed to customer specifications. JEDEC version 5.0 introduces “Production State Awareness” to help avoid possible data corruption during soldering. Only a predefined part of the whole device’s available space can be supported by this feature.

BSP Support and Services

Our Application Support Team can help you customize the included Linux Board Support Package, ensuring optimal performance, faster time-to-market, and seamless integration with your development environment, hardware and applications.

Gilles Hendrikx

Gilles Hendrikx

Build Acceleration | Boards | UI | Development

Questions?

Multicore STM32MP1 architecture is ideal for Open Source Linux based applications with real-time and power constrained subsystems. Contact me to explore the best matching QS family module for your design.